Repair procedure :
- We could not investigate and testing handphone with power offer directly, its for forestall short connection has deliverred part or module in handphone. as a result of huge possibility once handphone fallen down therefore location of part or module changes but not in the ideal place, it might causes short connection deliver part or module in handphone.
- 1st handphone should forced open, heated, then we are reposition the location or position every part or module that modification caused of fallen down.
- once we break into, heat, and rearrange all elements locations or modules in the ideal places, therefore we could use power offer out to investigate and testing our handphone that problem within the software or hardwarenya.
- huge possibility part that brokens cause of fallen down are ic pa or ic power.
- however if ampere needle in power offer rise around ± 50 mili ampere when button on pressed, it implies that problem along at the software. strive out to re-flashing as according as kind and version or upgrade software version out to higher version.